Title :
Research on mating device of underwater vehicle based on robot knowledge
Author :
Zhang, Zhonglin ; Ye, Xiufen ; Wang, Liquan ; Zheng, Dayu
Author_Institution :
Coll. of Mech. & Electr. Eng., Harbin Eng. Univ., Harbin
Abstract :
With the development and research deeply on the ocean, underwater mating technique has received wide application such as exploration of ocean bed, scientific review, sunk ship salvage, underwater manufactory, deep ocean workstation, aid submarine lifesaving and military affairs field. In this paper, through researching on mating device at home and abroad, by using rotational skirt scheme, mating device of underwater vehicle was designed and three-dimension assembly design of two-joint rotational skirt has been accomplished. It is made know that the device can meet working space of underwater vehicle passageway and there is not interference phenomenon The finite element model of the device shell was established and the compute result can provide theoretic basis for selecting the shell material. By using of robot technique kinematics equation of rotational skirt was educed, kinematics simulation analyzing and reachable space simulating on mating mouth was put up. It is analyzed that the device can meet need of big obliquity and the foundation was built for control system design. The research content can provide reference for researching on engineering design of mating device of underwater vehicle.
Keywords :
finite element analysis; mobile robots; robot kinematics; underwater vehicles; mating device; robot knowledge; robot technique kinematics equation; rotational skirt scheme; three-dimension assembly design; underwater vehicle; Analytical models; Assembly; Computational modeling; Extraterrestrial phenomena; Kinematics; Marine vehicles; Oceans; Robots; Underwater vehicles; Workstations; Compression Resistance Shell; Kinematics Simulation; Mating Device; Rotational Skirt; The Finite Element Model; Underwater Vehicle;
Conference_Titel :
Mechatronics and Automation, 2008. ICMA 2008. IEEE International Conference on
Conference_Location :
Takamatsu
Print_ISBN :
978-1-4244-2631-7
Electronic_ISBN :
978-1-4244-2632-4
DOI :
10.1109/ICMA.2008.4798799