DocumentCode
2960055
Title
New SMD ball pins designed for power
Author
Ehrman, Barry A. ; Balocco, Didier ; Gall, Antoine Le
Author_Institution
Saft Power Syst., Green
fYear
2007
fDate
Sept. 30 2007-Oct. 4 2007
Firstpage
313
Lastpage
318
Abstract
In this paper, we will present information on a new type of SMD termination using balls. In contrast to the solder balls used in low-power BGA applications for silicon packaging, the balls used for these DC-DC converters are rigid metal, plated to accept an optimum solder coating. We will analyze key parameters for these ball terminations such as co-planarity, positioning, soldering results and reliability, and compare them to more commonly used types of SMD pins.
Keywords
DC-DC power convertors; ball grid arrays; soldering; surface mount technology; DC-DC converters; SMD ball pins; SMD termination; low-power BGA applications; optimum solder coating; rigid metal; silicon packaging; solder balls; surface mount devices; Assembly; Copper; DC-DC power converters; Environmentally friendly manufacturing techniques; Lead; Pins; Power systems; Soldering; Springs; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Telecommunications Energy Conference, 2007. INTELEC 2007. 29th International
Conference_Location
Rome
Print_ISBN
978-1-4244-1627-1
Electronic_ISBN
978-1-4244-1628-8
Type
conf
DOI
10.1109/INTLEC.2007.4448790
Filename
4448790
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