Title :
A new type of high lead count pre-molded PLCC
Author :
Bolger, Justin C.
Author_Institution :
J.C. Bolger Corp., Dover, MA, USA
Abstract :
A family of low-cost, premolded plastic or plastic/metal, cavity packages intended for surface mounting of ICs with 84 to 300 external leads is described. The packages are based on a method for forming the internal copper circuitry that provides performance and design advantages, as well as cost savings, over previous methods using stamped copper lead frames or electrodeposited copper circuitry. Flexible circuit films are made by photoimaging and etching a sheet of 1-mil-thick rolled copper that has been adhesive-bonded to a 2-mil-thick Kapton support film. The circuit fabrication and assembly method, circuit film design, lead configuration, lid and base design, and thermal performance are described
Keywords :
etching; packaging; plastics; printed circuit manufacture; surface mount technology; Kapton support film; assembly; cavity packages; circuit fabrication; circuit film design; cost; etching; internal copper circuitry; lead configuration; lead count; photoimaging; pre-molded PLCC; premolded plastic; surface mounting; thermal performance; Bonding; Ceramics; Circuits; Copper; Costs; Encapsulation; Heat transfer; Lead; Plastic packaging; Stress;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77783
