Title :
Test structures for MCM-D technology characterization
Author :
Lozano, M. ; Santander, J. ; Cabruja, E. ; Perellò, C. ; Ullán, M. ; Lora-Tamayo, E.
Author_Institution :
CSIC, Barcelona, Spain
Abstract :
In our multichip module technology (MCM-D), a silicon chip is used as a substrate on which other commercial chips are flipped and soldered by a screen-printing method. This complex technology has specific test problems. In this paper, we present a set of classical and novel test structures addressed to the full characterization of an MCM/flip-chip/ball grid array/silicon substrate technology. We focus especially on the measurement of the chip-to-chip ball contact resistance, and on the electrical influence of nearby chips placed on top of circuits on the substrate
Keywords :
contact resistance; elemental semiconductors; flip-chip devices; integrated circuit packaging; integrated circuit testing; microassembling; multichip modules; silicon; soldering; surface mount technology; MCM-D; MCM-D technology characterization; MCM/flip-chip/ball grid array/silicon substrate technology; Si; chip electrical effects; chip-to-chip ball contact resistance; flip-chip; multichip module technology; screen-printing solder method; silicon chip substrate; soldering; substrate circuits; test structures; CMOS technology; Electronics packaging; Fabrication; Flip chip; Integrated circuit interconnections; Multichip modules; Semiconductor device measurement; Silicon; Substrates; Testing;
Conference_Titel :
Microelectronic Test Structures, 1998. ICMTS 1998., Proceedings of the 1998 International Conference on
Conference_Location :
Kanazawa
Print_ISBN :
0-7803-4348-4
DOI :
10.1109/ICMTS.1998.688065
