Title :
The study of plastic package cracking induced by the moisture/solder reflow process
Author :
Kitagawa, Hideki ; Kido, Youchirou ; Maeda, Kouichi ; Umeda, Yoshikatsu ; Sano, Hiroyasu ; Hasegawa, Shinichi
Author_Institution :
Texas Instrum. Japan Ltd., Ibaraki, Japan
Abstract :
The relationship between the size of plastic internal cracks and the extent of plastic delamination was investigated by using scanning acoustic tomography and visual cross-sectional inspection. Plastic internal cracks grow larger as plastic delamination spreads during consecutive moisture/solder reflow process stress tests. The effect of die pad size on plastic package cracking induced by the moisture/solder reflow process was studied. It was found that the extent of package cracking decreased with longer die pads due to the venting effect of the support pin. A package design that demonstrates good performance with respect to package cracks is presented
Keywords :
acoustic microscopy; crack detection; inspection; packaging; thermal stress cracking; die pad size; moisture/solder reflow process; plastic delamination; plastic internal cracks; plastic package cracking; scanning acoustic tomography; support pin; venting effect; visual cross-sectional inspection; Delamination; Electronics packaging; Inspection; Moisture; Plastic packaging; Samarium; Surface cracks; Temperature; Testing; Thermal stresses;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77787
