Title :
Thermal stress analysis of tape automated bonding packages and interconnections
Author :
Lau, John H. ; Rice, Donald W. ; Harkins, C. Girvin
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
A study of the stresses and strains in tape-automated-bonding (TAB) assemblies using a nonlinear three-dimensional finite-element method is discussed. Emphasis is placed on the thermomechanical behavior of TAB assembly beam leads, polyimide rings, gold bumps, silicon chips, and solder joints. It is found that the TAB beam leads are more likely to fail than the solder joints in conventional surface-mount-technology packages. Furthermore, the analytical results agree with the observed failure mechanisms of the beam leads. The results should be useful in understanding and designing more reliable advanced surface mount assemblies
Keywords :
failure analysis; finite element analysis; lead bonding; packaging; surface mount technology; thermal stresses; TAB; assembly beam leads; failure mechanisms; gold bumps; interconnections; nonlinear three-dimensional finite-element method; polyimide rings; solder joints; strains; stresses; surface mount assemblies; tape automated bonding packages; thermomechanical behavior; Assembly; Bonding; Capacitive sensors; Failure analysis; Finite element methods; Lead; Packaging; Soldering; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77789