Title :
Comparison between back-to-back and matrix converters based on thermal stress of the switches
Author :
Casadei, D. ; Grandi, G. ; Rossi, C. ; Trentin, A. ; Zarri, L.
Author_Institution :
Dipartimento di Ingegneria Elettrica, Universita di Bologna, Italy
Abstract :
A comparison between a matrix converter and a back-to-back converter feeding a passive load is presented in this paper, with the aim of determining the converter topology which yields the highest output power per switches number. The comparison has been performed for different values of the output frequency. For each output frequency the load power has been increased until one of the switching devices reaches the maximum thermal stress, so defining the maximum output power of the converter. For this purpose, a simplified thermal model has been used to evaluate the junction temperature of the switches on the basis of the switch losses. An accurate computer model of both converters has been implemented taking into account the modulation laws and the real characteristics of the switching devices. Simulation results are presented showing the different behaviour of the two converters as a function of the output frequency. It has been verified that matrix converters perform better than back-to-back converters at low output frequencies.
Keywords :
matrix convertors; network topology; passive networks; switching convertors; thermal stresses; back-to-back and matrix converters; converter topology; junction temperature; passive load; switch losses; thermal stress; Computational modeling; Frequency conversion; Matrix converters; Power generation; Switches; Switching converters; Temperature; Thermal loading; Thermal stresses; Topology; Back-to-Back converter; Matrix converter; Switch losses; Switch thermal stress;
Conference_Titel :
Industrial Electronics, 2004 IEEE International Symposium on
Print_ISBN :
0-7803-8304-4
DOI :
10.1109/ISIE.2004.1571964