• DocumentCode
    2961498
  • Title

    Comparison between back-to-back and matrix converters based on thermal stress of the switches

  • Author

    Casadei, D. ; Grandi, G. ; Rossi, C. ; Trentin, A. ; Zarri, L.

  • Author_Institution
    Dipartimento di Ingegneria Elettrica, Universita di Bologna, Italy
  • Volume
    2
  • fYear
    2004
  • fDate
    4-7 May 2004
  • Firstpage
    1081
  • Abstract
    A comparison between a matrix converter and a back-to-back converter feeding a passive load is presented in this paper, with the aim of determining the converter topology which yields the highest output power per switches number. The comparison has been performed for different values of the output frequency. For each output frequency the load power has been increased until one of the switching devices reaches the maximum thermal stress, so defining the maximum output power of the converter. For this purpose, a simplified thermal model has been used to evaluate the junction temperature of the switches on the basis of the switch losses. An accurate computer model of both converters has been implemented taking into account the modulation laws and the real characteristics of the switching devices. Simulation results are presented showing the different behaviour of the two converters as a function of the output frequency. It has been verified that matrix converters perform better than back-to-back converters at low output frequencies.
  • Keywords
    matrix convertors; network topology; passive networks; switching convertors; thermal stresses; back-to-back and matrix converters; converter topology; junction temperature; passive load; switch losses; thermal stress; Computational modeling; Frequency conversion; Matrix converters; Power generation; Switches; Switching converters; Temperature; Thermal loading; Thermal stresses; Topology; Back-to-Back converter; Matrix converter; Switch losses; Switch thermal stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2004 IEEE International Symposium on
  • Print_ISBN
    0-7803-8304-4
  • Type

    conf

  • DOI
    10.1109/ISIE.2004.1571964
  • Filename
    1571964