• DocumentCode
    2961866
  • Title

    Simulation of chassis electromagnetic shielding characteristic based on ANSYS

  • Author

    Zheng, Shi ; Ping-an, Du ; Yong, Wang ; Jian-tao, Liu

  • Author_Institution
    Dept. of Mech. & Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
  • fYear
    2008
  • fDate
    5-8 Aug. 2008
  • Firstpage
    1024
  • Lastpage
    1029
  • Abstract
    In electronic equipment, the chassis has both the function of mechanical support and electromagnetic shielding. In the paper, the shielding effect of chassis in high-frequency electromagnetic environment is numerically analyzed with ANSYS. Through the simulation, it is can known that the maximum shielding effect can be obtained with fully shielded structure, but the cooling requirement can not be meet. Thus, the aperture is designed to enhance the thermal performance of the chassis, but a great deal of electromagnetic energy leak occurs simultaneously. To overcome the contradiction between shielding effectiveness and cooling, a waveguide window is used over the aperture. According to the theoretical and numerical analysis, an effective method to design waveguide window is proposed. The numerical simulation method of the shielding effectiveness of the chassis is validated and can be applied in applications.
  • Keywords
    electrical engineering computing; electromagnetic shielding; numerical analysis; waveguides; ANSYS; chassis electromagnetic shielding characteristic; electromagnetic energy; electronic equipment; high-frequency electromagnetic environment; numerical analysis; waveguide window; Apertures; Cooling; Design methodology; Electromagnetic analysis; Electromagnetic shielding; Electromagnetic waveguides; Electronic equipment; Numerical analysis; Numerical simulation; Waveguide theory; aperture; fully shielded; high-frequency; shielding; waveguide window;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation, 2008. ICMA 2008. IEEE International Conference on
  • Conference_Location
    Takamatsu
  • Print_ISBN
    978-1-4244-2631-7
  • Electronic_ISBN
    978-1-4244-2632-4
  • Type

    conf

  • DOI
    10.1109/ICMA.2008.4798899
  • Filename
    4798899