DocumentCode
2961866
Title
Simulation of chassis electromagnetic shielding characteristic based on ANSYS
Author
Zheng, Shi ; Ping-an, Du ; Yong, Wang ; Jian-tao, Liu
Author_Institution
Dept. of Mech. & Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2008
fDate
5-8 Aug. 2008
Firstpage
1024
Lastpage
1029
Abstract
In electronic equipment, the chassis has both the function of mechanical support and electromagnetic shielding. In the paper, the shielding effect of chassis in high-frequency electromagnetic environment is numerically analyzed with ANSYS. Through the simulation, it is can known that the maximum shielding effect can be obtained with fully shielded structure, but the cooling requirement can not be meet. Thus, the aperture is designed to enhance the thermal performance of the chassis, but a great deal of electromagnetic energy leak occurs simultaneously. To overcome the contradiction between shielding effectiveness and cooling, a waveguide window is used over the aperture. According to the theoretical and numerical analysis, an effective method to design waveguide window is proposed. The numerical simulation method of the shielding effectiveness of the chassis is validated and can be applied in applications.
Keywords
electrical engineering computing; electromagnetic shielding; numerical analysis; waveguides; ANSYS; chassis electromagnetic shielding characteristic; electromagnetic energy; electronic equipment; high-frequency electromagnetic environment; numerical analysis; waveguide window; Apertures; Cooling; Design methodology; Electromagnetic analysis; Electromagnetic shielding; Electromagnetic waveguides; Electronic equipment; Numerical analysis; Numerical simulation; Waveguide theory; aperture; fully shielded; high-frequency; shielding; waveguide window;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation, 2008. ICMA 2008. IEEE International Conference on
Conference_Location
Takamatsu
Print_ISBN
978-1-4244-2631-7
Electronic_ISBN
978-1-4244-2632-4
Type
conf
DOI
10.1109/ICMA.2008.4798899
Filename
4798899
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