• DocumentCode
    2962491
  • Title

    A hybrid prognostics methodology for electronic products

  • Author

    Kumar, Sachin ; Torres, Myra ; Chan, Y.C. ; Pecht, Michael

  • Author_Institution
    Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD
  • fYear
    2008
  • fDate
    1-8 June 2008
  • Firstpage
    3479
  • Lastpage
    3485
  • Abstract
    Prognostics and health management enables in-situ assessment of a productpsilas performance degradation and deviation from an expected normal operating condition. A unique hybrid prognostics and health management methodology combining both data-driven and physics-of-failure models is proposed for fault diagnosis and life prediction. The shortcomings of using data-driven and physics-of-failure methodologies independently are discussed. These approaches estimate future system health, based on a systems current health status, historical performance, and operating environmental conditions. Although these methodologies are applicable to legacy, current, and future electronics, and ranging from components to circuit assemblies and electronic products, the hybrid approach is preferred due to its capability to include potential failure precursor parameters with failure mechanism, thus improving accuracy in prognostic estimates. Various works on data-driven and physics-of-failure approaches to prognostics for electronics are summarized and a hybrid methodology case study is presented.
  • Keywords
    electronic products; fault diagnosis; electronic products; health management; hybrid prognostics methodology; in-situ assessment; physics-of-failure approaches; physics-of-failure methodologies; product performance degradation; Assembly; Circuits; Degradation; Failure analysis; Fault diagnosis; Predictive models; Prognostics and health management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Networks, 2008. IJCNN 2008. (IEEE World Congress on Computational Intelligence). IEEE International Joint Conference on
  • Conference_Location
    Hong Kong
  • ISSN
    1098-7576
  • Print_ISBN
    978-1-4244-1820-6
  • Electronic_ISBN
    1098-7576
  • Type

    conf

  • DOI
    10.1109/IJCNN.2008.4634294
  • Filename
    4634294