Title :
Molded carrier rings for fine pitch surface mount packages
Author :
Hamilton, J. ; McShane, M. ; Bigler, C. ; Casto, J. ; Lin, P.
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
A molded carrier ring concept intended to reduce the incidence of bent leads and coplanarity rejects while providing increased output-to-mix potential and easy standardization for customers and equipment manufacturers is presented. The methodologies used to design a family of molded carrier rings around various quad-flat-pack and plastic quad-flat-pack package types are described. The algorithms and assumptions used to optimize the ring size and shape are discussed. Test contact design and performance, electrical characteristics, and thermal/mechanical modeling are also discussed
Keywords :
VLSI; integrated circuit technology; surface mount technology; VLSI component packaging; algorithms; electrical characteristics; fine pitch surface mount packages; molded carrier ring; plastic quad-flat-pack package; quad flat pack package; standardization; test contact design; thermal/mechanical modeling; Circuit testing; Contacts; Electronics packaging; Packaging machines; Plastic packaging; Printed circuits; Semiconductor device packaging; Shape; Six sigma; Standardization;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77797
