Title :
Intelligent system for material quality control using impact-echo testing
Author :
Salazar, Addisson ; Serrano, Arturo ; Vergara, Luis ; Miralles, Ramón
Author_Institution :
Inst. of Telecommun. & Multimedia Applic., Polytech. Univ. of Valencia. Camino de Vera s/n, Valencia
Abstract :
This paper introduces an intelligent system to discern the quality of materials inspected by the impact-echo technique. The system includes a hardware setup to inspect parallelepiped-shape materials and a procedure to classify the material depending on its quality condition. Four levels of classification with different grades of knowledge about the material defects are approached: material condition, kind of defect, defect orientation, and defect dimension. The number of classes (material qualities) in the lowest classification level is 12. The procedure is applied on signals coming from 3D finite element simulations and lab experiments with aluminium specimens. The classification procedure is performed using frequency features and the classification algorithms: LDA, MLP, and an algorithm based on mixtures of independent component analyzers. We show the best performance to model the impact-echo data is obtained by the ICA mixture model.
Keywords :
echo; finite element analysis; impact (mechanical); impact testing; independent component analysis; knowledge based systems; production engineering computing; quality control; 3D finite element simulation; ICA mixture model; classification algorithm; defect dimension; defect orientation; frequency features; impact-echo data; impact-echo testing; independent component analyzer; intelligent system; material classification; material condition; material defects; material quality control; Aluminum; Classification algorithms; Finite element methods; Frequency; Hardware; Independent component analysis; Intelligent systems; Materials testing; Quality control; System testing; Classification; ICA mixtures; impact-echo testing; quality control;
Conference_Titel :
Cybernetic Intelligent Systems, 2008. CIS 2008. 7th IEEE International Conference on
Conference_Location :
London
Print_ISBN :
978-1-4244-2914-1
Electronic_ISBN :
978-1-4244-2915-8
DOI :
10.1109/UKRICIS.2008.4798954