Title :
IEEE 2007 International Interconnect Technology Conference
Abstract :
The following topics are dealt with: metallization; integration; systems; reliability/contact; and new concepts.
Keywords :
electromigration; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit technology; 3D integration; IC technology; electromigration; interconnect technology; reliability;
Conference_Titel :
International Interconnect Technology Conference, IEEE 2007
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-1069-X
Electronic_ISBN :
1-4244-1070-3
DOI :
10.1109/IITC.2007.382323
