Title :
Air-gap transmission lines for multiprocessor interconnects on FR-4 and BT substrates
Author :
Spencer, Todd J. ; Kohl, Paul A.
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
The fabrication and characterization of low loss parallel plate and microstrip lines with an air dielectric layer is described. The lines are characterized by capacitance and loss tangent at 10 kHz and 100 kHz and by S-parameters up to 10 GHz. The inclusion of the air-gap significantly reduced the loss tangent and lowered the dielectric constant to between 1.5 and 1.8. More complicated transmission line structures could be fabricated using the described techniques.
Keywords :
CMOS integrated circuits; S-parameters; air gaps; capacitance; dielectric thin films; integrated circuit interconnections; losses; microstrip lines; multiprocessor interconnection networks; permittivity; transmission lines; BT substrates; FR-4 substrate; S-parameters; air-gap transmission line structures; capacitance; dielectric constant; frequency 10 kHz; frequency 100 kHz; loss tangent reduction; low loss parallel plate characterization; microstrip lines; multiprocessor interconnects; Air gaps; Dielectric constant; Dielectric losses; Dielectric substrates; Integrated circuit interconnections; Land surface temperature; Polymers; Power transmission lines; Propagation losses; Transmission lines;
Conference_Titel :
International Interconnect Technology Conference, IEEE 2007
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-1069-X
Electronic_ISBN :
1-4244-1070-3
DOI :
10.1109/IITC.2007.382344
