Air-gap transmission lines for multiprocessor interconnects on FR-4 and BT substrates

Author

Spencer, Todd J. ; Kohl, Paul A.

Author_Institution

Georgia Inst. of Technol., Atlanta

fYear

2007

fDate

4-6 June 2007

Firstpage

34

Lastpage

36

Abstract

The fabrication and characterization of low loss parallel plate and microstrip lines with an air dielectric layer is described. The lines are characterized by capacitance and loss tangent at 10 kHz and 100 kHz and by S-parameters up to 10 GHz. The inclusion of the air-gap significantly reduced the loss tangent and lowered the dielectric constant to between 1.5 and 1.8. More complicated transmission line structures could be fabricated using the described techniques.

Keywords

CMOS integrated circuits; S-parameters; air gaps; capacitance; dielectric thin films; integrated circuit interconnections; losses; microstrip lines; multiprocessor interconnection networks; permittivity; transmission lines; BT substrates; FR-4 substrate; S-parameters; air-gap transmission line structures; capacitance; dielectric constant; frequency 10 kHz; frequency 100 kHz; loss tangent reduction; low loss parallel plate characterization; microstrip lines; multiprocessor interconnects; Air gaps; Dielectric constant; Dielectric losses; Dielectric substrates; Integrated circuit interconnections; Land surface temperature; Polymers; Power transmission lines; Propagation losses; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

International Interconnect Technology Conference, IEEE 2007

Conference_Location

Burlingame, CA

Print_ISBN

1-4244-1069-X

Electronic_ISBN

1-4244-1070-3

Type

conf

DOI

10.1109/IITC.2007.382344

Filename

4263656