Title :
CMOS Integration of Capacitive, Optical, and Electrical Interconnects
Author :
Lexau, Jon ; Zheng, Xuezhe ; Bergey, Jon ; Krishnamoorthy, Ashok V. ; Ho, Ron ; Drost, Robert ; Cunningham, Jack
Author_Institution :
Sun Microsystems, Menlo Park
Abstract :
We present a 90 nm test chip integrating proximity communication, optics using external lasers and photodiodes, and CML electronics on a single CMOS chip which can route data at multi-Gb/s rates through any combination of its three interconnect interfaces. A robust and flexible unclocked datapath allows independent timing and margin characterization of each path.
Keywords :
CMOS integrated circuits; current-mode logic; integrated circuit interconnections; CMOS integration; capacitive interconnects; electrical interconnects; independent timing; interconnect interfaces; margin characterization; optical interconnects; proximity communication; size 90 nm; High speed optical techniques; Integrated optics; Optical buffering; Optical crosstalk; Optical fiber networks; Optical interconnections; Optical transmitters; Photodetectors; Testing; Vertical cavity surface emitting lasers;
Conference_Titel :
International Interconnect Technology Conference, IEEE 2007
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-1069-X
Electronic_ISBN :
1-4244-1070-3
DOI :
10.1109/IITC.2007.382354
