• DocumentCode
    2963736
  • Title

    CMOS Integration of Capacitive, Optical, and Electrical Interconnects

  • Author

    Lexau, Jon ; Zheng, Xuezhe ; Bergey, Jon ; Krishnamoorthy, Ashok V. ; Ho, Ron ; Drost, Robert ; Cunningham, Jack

  • Author_Institution
    Sun Microsystems, Menlo Park
  • fYear
    2007
  • fDate
    4-6 June 2007
  • Firstpage
    78
  • Lastpage
    80
  • Abstract
    We present a 90 nm test chip integrating proximity communication, optics using external lasers and photodiodes, and CML electronics on a single CMOS chip which can route data at multi-Gb/s rates through any combination of its three interconnect interfaces. A robust and flexible unclocked datapath allows independent timing and margin characterization of each path.
  • Keywords
    CMOS integrated circuits; current-mode logic; integrated circuit interconnections; CMOS integration; capacitive interconnects; electrical interconnects; independent timing; interconnect interfaces; margin characterization; optical interconnects; proximity communication; size 90 nm; High speed optical techniques; Integrated optics; Optical buffering; Optical crosstalk; Optical fiber networks; Optical interconnections; Optical transmitters; Photodetectors; Testing; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    International Interconnect Technology Conference, IEEE 2007
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    1-4244-1069-X
  • Electronic_ISBN
    1-4244-1070-3
  • Type

    conf

  • DOI
    10.1109/IITC.2007.382354
  • Filename
    4263666
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2963736