Title :
An innovation to a multilayer hybrid circuit laminate composed of a sophisticated-resin combination of a new aramid-paper and an epoxy impregnant
Author :
Tsunashima, Eiichi ; Okuno, Atsushi ; Oyama, Noritaka ; Hirakawa, Tadashi ; Nishimura, Kunio
Author_Institution :
Matsushita Electron. Corp., Kyoto, Japan
Abstract :
A wholly organic substrate that combines aramid-paper reinforcement and a sophisticated epoxy resin is presented. The reinforcement consists of an organic fiber mat composed of aromatic polyether amide. The impregnant is an aromatic amine-adducted epoxy of low volatility. The properties of the material and their theoretical basis are examined. Experimental results on a 0.4-mm-thick substrate of this material are presented and discussed
Keywords :
filled polymers; hybrid integrated circuits; integrated circuit technology; laminates; substrates; aramid-paper; aromatic polyether amide; epoxy impregnant; epoxy resin; multilayer hybrid circuit laminate; organic fiber mat; organic substrate; Circuits; Epoxy resins; Etching; Insulation; Laminates; Nonhomogeneous media; Rough surfaces; Stress; Surface roughness; Technological innovation;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77807
