DocumentCode :
2964885
Title :
Elimination of body effects in SOI CMOS devices
Author :
Pemmaraju, Sandeep ; Parke, Stephen A.
Author_Institution :
Boise State Univ., ID, USA
fYear :
2004
fDate :
2004
Firstpage :
126
Lastpage :
128
Abstract :
Tremendous research is going on in using silicon-on-insulator (SOI) devices for commercial purposes. Many advantages, like low junction capacitance, complete isolation of devices, smaller layout area, low power consuming circuits and lesser delays have enhanced the possibility of faster circuits. Still, problems with the parasitic floating body effects in partially depleted SOI (PDSOI) devices exist. The effects of the floating body are studied through the DC characteristics of PDSOI device structures. Effects like the kink effect, loss of gate control, self-heating effect and impact ionization are investigated. The impact ionization and the bipolar latch up effects tend to dominate in partially depleted (PDSOI) devices. DC characteristics of body tied to source, dynamic threshold MOS (DTMOS), and PDSOI devices are presented.
Keywords :
MOSFET; impact ionisation; leakage currents; silicon-on-insulator; DTMOS; PDSOI; SOI CMOS devices; Si-SiO2; bipolar latch up; body effect elimination; body tied to source devices; dynamic threshold MOS; gate control loss; gate induced drain leakage current; impact ionization; isolation; kink effect; low junction capacitance; parasitic floating body effects; partially depleted SOI; self-heating effect; silicon-on-insulator devices; Charge carrier processes; Circuits; Electrons; Impact ionization; Insulation; MOS devices; Semiconductor thin films; Silicon on insulator technology; Substrates; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Electron Devices, 2004 IEEE Workshop on
Print_ISBN :
0-7803-8369-9
Type :
conf
DOI :
10.1109/WMED.2004.1297373
Filename :
1297373
Link To Document :
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