DocumentCode :
2965236
Title :
Piezoresistive n-type 4H-SiC pressure sensor with membrane formed by mechanical milling
Author :
Akiyama, Terunobu ; Briand, Danick ; De Rooij, Nico F.
Author_Institution :
Actuators & Microsyst. Lab. (SAMLAB), Ecole Polytech. Fed. de Lausanne (EPFL), Neuchâtel, Switzerland
fYear :
2011
fDate :
28-31 Oct. 2011
Firstpage :
222
Lastpage :
225
Abstract :
A 4H-SiC pressure sensor with piezoresistive transducers, for harsh environment applications, e.g., high temperature (~650°C) and/or in corrosive chemicals is presented. The sensing membrane, 1 mm in diameter and 50 μm in thickness, was formed by milling (drilling) a bulk single crystal SiC wafer. Both transverse and longitudinal piezoresistors were formed on the membrane out of an n-type SiC epitaxial layer. Ohmic contacts were obtained with Ta/Ni/Pt metallization followed by annealing at 1000°C for 20 min. The sensor was assembled on a small board and characterized under hydrostatic pressures up to 60 bar at room temperature. The obtained pressure sensitivity was 268 μV/V/bar. The sensor chip was exposed in air at 600°C for 165 hours and changes in bridge resistance were measured.
Keywords :
milling; piezoresistive devices; pressure sensors; silicon compounds; SiC; corrosive chemicals; harsh environment applications; mechanical milling; membrane formed; n-type 4H-SiC pressure sensor; piezoresistive transducers; temperature 600 degC; time 165 hour; Annealing; Nickel; Piezoresistive devices; Resistance; Silicon carbide; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2011 IEEE
Conference_Location :
Limerick
ISSN :
1930-0395
Print_ISBN :
978-1-4244-9290-9
Type :
conf
DOI :
10.1109/ICSENS.2011.6126936
Filename :
6126936
Link To Document :
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