Title :
Heat Transfer from Rectangular Pin Fin Heat Sinks under Air Jet Impingement
Author :
Fubing, Tu ; Jianfeng, Mao ; Jiemin, Zhou ; Wenhui, Zeng ; Yu, Jia ; Huifen, Wu
Author_Institution :
Sch. of Energy Sci. & Power Eng., Central South Univ., Changsha, China
Abstract :
Increased miniaturization, higher power densities, and demands on system performance and reliability in electronic systems have necessitated more aggressive heat removal techniques in the thermal management of electronic components. Air jet impingement, especially in conjunction with surface enhancement, is an attractive option since a heat removal compacity similar to liquid cooling may be achieved by this means. Three rectangular pin fin heat sinks of different height were adopted and the heat transfer process within the heat sink under air jet impingement was experimentally studied. First, the thermal resistances (θab) of the three heat sink related to Re and H/D were obtained respectively, and The equation of the average Nusselt number ((Nu)̅) changing with Re, H/D and fin height( Hf ) on the chip surface which is under the three heat sinks was developed by the least square method as well. The results show that θab decreases with Re and H/D, but this tend becomes less significant as Re and H/D increase to certain value. The (Nu)̅ correlated error in terms of Re, H/D and fin height( Hf ) was within 9%. When the range of then Renolds number is 3159~15798, the coefficient of convection heat transfer can reach 500~1100 W/m2·K.
Keywords :
heat sinks; heat transfer; jets; least mean squares methods; reliability; thermal management (packaging); thermal resistance; turbulence; Renolds number; air jet impingement; average Nusselt number; convection heat transfer coefficient; electronic components; electronic system reliability; heat removal techniques; heat transfer process; least square method; liquid cooling; power density; rectangular pin fin heat sinks; surface enhancement; thermal management; thermal resistances; Equations; Fitting; Heat sinks; Heat transfer; Temperature measurement; Trigeneration; Air jet impingement; Nusselt number; Pin fin heat sink; Thermal resistance;
Conference_Titel :
Intelligent Computation Technology and Automation (ICICTA), 2011 International Conference on
Conference_Location :
Shenzhen, Guangdong
Print_ISBN :
978-1-61284-289-9
DOI :
10.1109/ICICTA.2011.494