DocumentCode :
2965860
Title :
A new multi-chip module using a copper polyimide multi-layer substrate
Author :
Sasaki, Shinichi ; Kon, Taichi ; Ohsaki, Takaaki
Author_Institution :
NTT, Tokyo, Japan
fYear :
1989
fDate :
22-24 May 1989
Firstpage :
629
Lastpage :
635
Abstract :
A multichip module using a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors is discussed. This substrate contains small copper columnar vias, which reduce the thermal resistance of the polyimide layers without causing a channel accommodation drop, and thin-film resistors for terminated transmission. The module can mount a high density of high-speed LSI chips that produce twice as much heat as those in conventional modules and can transmit high-speed pulses at over 2 Gb/s. The structure and features of the module, its design and fabrication, and its electrical and thermal characteristics are discussed
Keywords :
copper; integrated circuit technology; large scale integration; modules; packaging; polymers; substrates; Cu; Cu-polyimide multilayer substrate; columnar vias; high density packaging; high-speed LSI chips; multichip module; thermal characteristics; thermal resistance; thin-film resistors; Conductors; Copper; Dielectric substrates; Dielectric thin films; Large scale integration; Multichip modules; Nonhomogeneous media; Polyimides; Resistors; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
Type :
conf
DOI :
10.1109/ECC.1989.77816
Filename :
77816
Link To Document :
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