• DocumentCode
    296589
  • Title

    The expected costs and benefits of EDI in the modular supply chain

  • Author

    Hoogeweegen, Martijn R. ; Teunissen, Wim J M ; Vervest, Peter H M ; Wagenaar, René W.

  • Author_Institution
    Sch. of Manage., Erasmus Univ., Rotterdam, Netherlands
  • Volume
    4
  • fYear
    1996
  • fDate
    3-6 Jan 1996
  • Firstpage
    302
  • Abstract
    We examine how the adoption of EDI can increase the flexibility of a modular supply chain of organisations to match customised demand, and how expected costs and benefits of such the adoption are distributed among these organisations. Within a modular supply chain, organisations form process module networks in response to customised demand. These networks indicate in what order process modules need to be operated, how they are linked to each other, and how many resources they use. We have developed the modular design approach to support the design of process module networks. By means of an automated tool, called Chain Moduling, costs and lead times of several designed networks can be computed and compared. The first application of Chain Moduling demonstrates how the adoption of EDI impacts a specific process module network. The approach, the tool, the first application and future research are discussed
  • Keywords
    DP industry; business data processing; cost-benefit analysis; economics; electronic data interchange; marketing; software standards; telecommunication standards; Chain Moduling; EDI; automated tool; customised demand; expected costs; future research; modular design approach; modular supply chain; process module network; process module networks; process modules; Computer networks; Costs; Current measurement; Data handling; Information technology; Process design; Production; Raw materials; Stress; Supply chains;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Sciences, 1996., Proceedings of the Twenty-Ninth Hawaii International Conference on ,
  • Conference_Location
    Wailea, HI
  • Print_ISBN
    0-8186-7324-9
  • Type

    conf

  • DOI
    10.1109/HICSS.1996.495351
  • Filename
    495351