New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization

A glass-ceramic multichip packaging technology for high-I/O-count, large-area silicon chips is discussed. The module substrate material is a new glass-ceramic (Corning 9641), which can be TCE (thermal coefficient of expansion) matched to silicon (3.4 p.p.m./°C). This material possesses a low dielectric constant (5.2), resulting in reduced package signal propagation delays. A 3-in, 36-chip test vehicle has been designed, fabricated, and tested to assess the electrical and thermal properties of the glass-ceramic and its usefulness in packaging applications. Chip and module sizes equal to or greater than 1 cm and 3 in, respectively, are targets for this packaging technology, referred to as the hybrid systems module (HSM). The electrical design and characterization of the HSM test vehicle are described