Title :
Thick film electrostatic printing [solar cell fabrication]
Author :
Teng, K.P. ; Karim, Abdul
Author_Institution :
Microelectron. Lab., Mississippi State Univ., MS, USA
Abstract :
A noncontact, electrostatic, thick film circuit printing technique, developed for the metallization of edge-defined film-fed-growth (EFG) solar cells, is discussed. The conventional thick-film solar cell inks were modified by adding 10-20% terpineol solvent. The effects of ink viscosity, applied voltages, nozzle diameter, and nozzle-to-substrate distance on line definition and ink flow rate were investigated. A simple theoretical model for the electrostatic ink ejection was derived. The minimum line width obtained was 3 mil. The use of multilayer printing increased the line film thickness. The maximum line width obtained was about 20-30 mil for a single run. The system is now completely computer-controlled and capable of printing films onto solar cell substrates reliably and with a high degree of accuracy. Multiple layer prints can be made with good layer-to-layer registration
Keywords :
electrostatics; metallisation; printing; semiconductor device manufacture; solar cells; thick film devices; 20 to 30 mil; 3 mil; applied voltages; computer controlled system; edge-defined film-fed-growth; electrostatic ink ejection; electrostatic printing; fabrication; ink flow rate; ink viscosity; layer-to-layer registration; line definition; line film thickness; minimum line width; model; multilayer printing; noncontact technique; nozzle diameter; nozzle-to-substrate distance; semiconductor device processing; solar cells; terpineol solvent; thick film circuit printing; Electrostatics; Fabrication; Ink; Metallization; Photovoltaic cells; Printing; Solvents; Thick film circuits; Thick films; Viscosity;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77825
