DocumentCode :
2966774
Title :
1.8 dB insertion loss 200 GHz CPW band pass filter integrated in HR SOI CMOS Technology
Author :
Gianesello, Frederic ; Gloria, D. ; Montusclat, S. ; Raynaud, C. ; Boret, S. ; Dambrine, G. ; Lepilliet, S. ; Martineau, B. ; Pilard, R.
Author_Institution :
STMicroelectron., Grenoble
fYear :
2007
fDate :
3-8 June 2007
Firstpage :
453
Lastpage :
456
Abstract :
Today, measurement of 65 nm CMOS [Dambrine, G., et al., 2005] and 130 nm-based SiGe HBTs [Chevalier, p. et al., 2004] technologies demonstrate both fT (current gain cut-off frequency) and fmax (maximum oscillation frequency) higher than 200 GHz, which are clearly comparable to advanced commercially available 100nm III-V HEMT. This increase allows new millimeter wave (MMW) applications on silicon. One of the success keys is then the passive integration. In this paper, on-chip coplanar waveguides (CPWs), which have been achieved in STMicroelectronics advanced nanometric RF CMOS High Resistivity (HR) SOI (rho > 1 kOmegaldrcm) process, and characterized up to 220 GHz are reported. Moreover, for the first time passive circuits working @ 220 GHz have been achieved and characterized demonstrating state-of-the-art performances and good agreement with electric simulations using developed models.
Keywords :
CMOS integrated circuits; band-pass filters; coplanar waveguides; field effect MIMIC; CMOS technology; CPW band pass filter; complementary metal-oxide-semiconductor; electric simulation; frequency 220 GHz; insertion loss; maximum oscillation frequency; millimeter wave application; on-chip coplanar waveguide; passive integration; size 130 nm; size 65 nm; Band pass filters; CMOS technology; Coplanar waveguides; Cutoff frequency; Germanium silicon alloys; HEMTs; III-V semiconductor materials; Insertion loss; Millimeter wave technology; Silicon germanium; High Resistivity; SOI; coplanar waveguide; filter; millimeter-wave (MMW); silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
ISSN :
0149-645X
Print_ISBN :
1-4244-0688-9
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2007.380486
Filename :
4263847
Link To Document :
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