Title :
High conductivity materials systems for advanced hybrids
Author :
Borland, W. ; Needes, C.R.S. ; Siuta, V.P. ; Nair, K.M.
Author_Institution :
E.I. Du Pont de Nemours, Wilmington, DE, USA
Abstract :
Two materials systems developed to meet the circuit density, cost, and reliability requirements of the future are discussed. High conductivity, high-resolution copper and silver-bearing conductors, dielectrics meeting more stringent reliability requirements, and resistors demonstrating excellent post trim stability are elements of these systems. The technology used in these systems is considered, with particular emphasis on new conductor and dielectric materials. Reliability data showing twenty-year operating life predictions are presented. Materials technology and its relationship to the reliability of hybrids are discussed
Keywords :
circuit reliability; dielectric materials; hybrid integrated circuits; integrated circuit technology; integrated circuit testing; life testing; metallisation; thick film circuits; 20 y; Ag bearing conductors; Cu bearing conductors; Series Q materials systems; circuit density; cost; dielectrics; high conductivity materials systems; hybrid microcircuits; operating life predictions; post trim stability; reliability requirements; resistors; thick film circuits; Circuits; Conducting materials; Conductivity; Conductors; Copper; Costs; Dielectric materials; Nonhomogeneous media; Quadratic programming; Resistors;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77828
