• DocumentCode
    2966988
  • Title

    Fully Packaged 4-bit 100 ps RFMEMS Time Delay

  • Author

    Muldavin, J. ; Bozler, C. ; Rabe, Steve ; Keast, C.

  • Author_Institution
    MIT Lincoln Lab., Lexington
  • fYear
    2007
  • fDate
    3-8 June 2007
  • Firstpage
    493
  • Lastpage
    496
  • Abstract
    This paper presents results of a fully packaged RFMEMS 4-bit, 100-ps capacitive time delay. The time delays are packaged using wafer scale low-loss and broad-band packaging technology developed at MIT Lincoln Laboratory (MIT-LL). The 4-bit 100 ps time delay has 1.8 dBplusmn1 dB insertion loss from 5-20 GHz.
  • Keywords
    electronics packaging; micromechanical devices; microwave devices; RFMEMS time delay; broad-band packaging; capacitive time delay; frequency 5 GHz to 20 GHz; wafer scale low-loss packaging; word length 4 bit; CMOS technology; Circuit simulation; Delay effects; Delay lines; Insertion loss; Loss measurement; Packaging; Scattering parameters; Silicon on insulator technology; Switches; MEMS; SP4T; hermetic; packaging; switch; time-delay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium, 2007. IEEE/MTT-S International
  • Conference_Location
    Honolulu, HI
  • ISSN
    0149-645X
  • Print_ISBN
    1-4244-0688-9
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2007.380515
  • Filename
    4263858
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2966988