Title :
Fully Packaged 4-bit 100 ps RFMEMS Time Delay
Author :
Muldavin, J. ; Bozler, C. ; Rabe, Steve ; Keast, C.
Author_Institution :
MIT Lincoln Lab., Lexington
Abstract :
This paper presents results of a fully packaged RFMEMS 4-bit, 100-ps capacitive time delay. The time delays are packaged using wafer scale low-loss and broad-band packaging technology developed at MIT Lincoln Laboratory (MIT-LL). The 4-bit 100 ps time delay has 1.8 dBplusmn1 dB insertion loss from 5-20 GHz.
Keywords :
electronics packaging; micromechanical devices; microwave devices; RFMEMS time delay; broad-band packaging; capacitive time delay; frequency 5 GHz to 20 GHz; wafer scale low-loss packaging; word length 4 bit; CMOS technology; Circuit simulation; Delay effects; Delay lines; Insertion loss; Loss measurement; Packaging; Scattering parameters; Silicon on insulator technology; Switches; MEMS; SP4T; hermetic; packaging; switch; time-delay;
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0688-9
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2007.380515
