Title :
Researching on Testing Method for Dynamic Property of Buffer Packaging
Author_Institution :
Coll. of Electr. & Control Eng., Xi´´an Univ. of Sci. & Technol., Xi´´an, China
Abstract :
The fragility of products and the dynamic characteristic of packaging material are important points in packaging dynamics. An intelligent testing instrument has been designed, which uses W78E52B SCM as CPU, and 2 axial mounted acceleration sensors as 3-Dimensional Acceleration sensor. The analogue output of the sensor is acquired by 16-bit ADC ADS8341, and transferred into inner memory. Through USB port data and parameters are transferred between PC and the device. With the input of dropping height and delay, the time of data sampling and logging is generated. Finally through PC software reading and analyze of the data is performed.
Keywords :
buffer circuits; integrated circuit packaging; integrated circuit testing; sensors; ADC ADS8341; CPU; PC software; USB port data; W78E52B SCM; axial mounted acceleration sensors; buffer packaging; dynamic property; intelligent testing instrument; packaging dynamics; packaging material; three-dimensional acceleration sensor; word length 16 bit; Automation; 3-Dimensional Acceleration; Memorizing; Single chip microprocessor; buffer Packaging; testing technology;
Conference_Titel :
Intelligent Computation Technology and Automation (ICICTA), 2011 International Conference on
Conference_Location :
Shenzhen, Guangdong
Print_ISBN :
978-1-61284-289-9
DOI :
10.1109/ICICTA.2011.579
