Development of a coated-wire-bonding technology

Author

Okikawa, Susumu ; Tanimoto, Michio ; Watanabe, Hiroshi ; Mikino, Hiroshi ; Kaneda, Tsuyoshi

Author_Institution

Hitachi Ltd., Tokyo, Japan

fYear

1989

fDate

22-24 May 1989

Firstpage

736

Lastpage

742

Abstract

A ball bonding technology for use in the prevention of electric shorts between wires, wires and tab edges, wires and chip edges, and wires and leads in plastic-sealed ICs is discussed. In this technology metallic wires are coated with insulation film before bonding. Two methods of removing unnecessary coating material at either end of the wire are examined. Coating film material selection and thickness are discussed. The coated-wire-bonding process and its reliability evaluation are described. The technology facilitates the manufacture of multipin application-specific integrated circuits (ASICs)

Keywords

application specific integrated circuits; circuit reliability; integrated circuit manufacture; integrated circuit technology; lead bonding; packaging; application-specific integrated circuits; ball bonding technology; coated-wire-bonding technology; electric shorts prevention; insulation film; metallic wires; microassembly; multipin ASIC; plastic-sealed ICs; reliability evaluation; Bonding; Cable insulation; Coatings; Manufacturing; Optical films; Packaging; Pins; Semiconductor device manufacture; Semiconductor materials; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77832

Filename

77832