Title :
Brazing to low-temperature fired thick films
Author :
Keusseyan, R.L. ; Marsh, W.E. ; Prados, R.A. ; Hirsch, R.G.
Author_Institution :
DuPont Electron., Research Triangle Park, NC, USA
Abstract :
The development of materials and processes for brazing, leads, pins, and heat sinks to alumina ceramic substrates is discussed. The substrates are metallized using either copper-, silver- or gold-based thick film pastes that are fired in the 850-950°C temperature range. The metal ceramic joint strengths obtained are comparable to those obtained using high-temperature fired tungsten or molybdenum-based metallizations
Keywords :
alumina; brazing; ceramics; integrated circuit technology; substrates; thick film circuits; 850 to 950 degC; Ag based pastes; Al2O3; Au based pastes; Cu based pastes; alumina ceramic substrates; brazing; heat sinks; leads; low-temperature fired; metal ceramic joint strengths; pins; thick films; Atmosphere; Ceramics; Copper; Heat sinks; Inorganic materials; Lead; Metallization; Pins; Substrates; Thick films;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77833
