DocumentCode :
2967582
Title :
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium
fYear :
1997
fDate :
13-15 Oct. 1997
Abstract :
The following topics were dealt with: reliability; assembly processes; semiconductor processing; environmentally conscious manufacturing; test, inspection and characterization; packaging; contract manufacturing; flip chip; sub-0.25 μm lithography; ball grid array; scheduling in semiconductor manufacturing; life-long learning.
Keywords :
manufacture; assembly; ball grid array; contract manufacturing; electronic manufacturing technology; environmental factors; flip chip; inspection; lithography; packaging; reliability; scheduling; semiconductor processing; testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX, USA
ISSN :
1089-8190
Print_ISBN :
0-7803-3929-0
Type :
conf
DOI :
10.1109/IEMT.1997.626856
Filename :
626856
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2967582
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