• DocumentCode
    296775
  • Title

    ZnO on diamond: SAWs and pseudo-SAWs

  • Author

    Adler, Eric L. ; Solie, Leland

  • Author_Institution
    Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
  • Volume
    1
  • fYear
    1995
  • fDate
    7-10 Nov 1995
  • Firstpage
    341
  • Abstract
    The development of low-loss UHF SAW filters has led to devices using the higher phase velocities of pseudo-surface-acoustic-waves and shear-horizontally polarized waves. Another way of obtaining higher velocities is to use higher-velocity materials. Diamond, for example, has a SAW velocity near 11 km/s and a longitudinal velocity close to 18 km/s. In this paper the dispersion characteristics and the SAW coupling constants of the ZnO on diamond structure are described for the two lowest order modes and for the high-velocity pseudo-SAW mode. The SAW coupling constants are given for the four possible transducer geometries. At constant thickness-frequency, for the two lowest order modes, an unexpectedly large coupling (2Δv/v) is found over a certain range of layer thickness-frequency product; 23% for the first mode and 15% for the second. Because of dispersion, calculating coupling at constant thickness-wavenumber (as is done frequently) produces results which are nearly four times smaller than those calculated at constant thickness-frequency
  • Keywords
    UHF filters; acoustic materials; diamond; dispersion (wave); surface acoustic wave filters; surface acoustic waves; ultrasonic dispersion; ultrasonic velocity; zinc compounds; 11 km/s; 18 km/s; C; SAW coupling constants; SAW velocity; ZnO on diamond; ZnO-C; dispersion characteristics; low-loss UHF SAW filters; phase velocities; pseudo-surface-acoustic-waves; shear-horizontally polarized waves; Frequency; Geometry; Piezoelectric films; Polarization; Sawing machines; Silicon; Substrates; Surface acoustic waves; Transducers; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1995. Proceedings., 1995 IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-2940-6
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1995.495594
  • Filename
    495594