• DocumentCode
    2968276
  • Title

    A comparison of friction measurement results using two slipmeters

  • Author

    Li, Kai Way ; Horng, Jing Hui

  • Author_Institution
    Dept. of Ind. Eng. & Syst. Manage., Chung-Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    8-11 Dec. 2009
  • Firstpage
    2159
  • Lastpage
    2163
  • Abstract
    Assessment of floor slip slipperiness is of paramount importance in quantifying the risk of slipping and falling incidents. Friction measurement is one of the major approaches in assessing floor slipperiness. The Brungraber Mark II is one of the slipmeters commonly used in the USA. Operation of the Mark II requires repetitive strikes of the footwear pad on the floor for a single reading. One of the disadvantages of the Mark II is that the operator needs to lift a 4.54 kg weight and releases it with an awkward kneeing posture for every trial. To remedy this drawback, the designer of Mark II has fabricated a new slipmeter named Mark III. Instead of been driven by a 4.54 kg weight, the Mark III is activated by a spring. This requires less physical effort in both carrying and operating as compared to that of the Mark II. However, there is no published data examining the reliability and consistency of this new device. In this study, we compare the friction measurement results of the two slipmeters under four floors, four footwear materials, and three surface conditions.
  • Keywords
    friction; mechanical variables measurement; meters; Brungraber Mark II; awkward kneeing posture; falling incidents; floor slip slipperiness; footwear pad; friction measurement; slipmeters; slipping; Engineering management; Footwear; Force measurement; Friction; Industrial engineering; Materials testing; Pollution measurement; Safety; Springs; Surface contamination; coefficient of friction; friction measurement; slipmeter; slips & falls;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-4869-2
  • Electronic_ISBN
    978-1-4244-4870-8
  • Type

    conf

  • DOI
    10.1109/IEEM.2009.5373122
  • Filename
    5373122