Title :
Medical imaging with capacitive micromachined ultrasound transducer (cMUT) arrays
Author_Institution :
Gen. Electr. Global Res., Niskayuna, NY, USA
Abstract :
Several groups have shown images made with capacitive micromachined ultrasound transducers (cMUTs). This new transducer technology has emerged as a leading research area because these devices are non-resonant and can be integrated with signal processing electronics. We review real time imaging performed with early silicon nitride devices. Then, we present new results from a wafer bonded cMUT probe produced and tested in our lab. These wafer bonded cMUTs show a fractional bandwidth of 130% (3-13 MHz), that covers almost the entire frequency range of interest for medical ultrasound. Further discussion outlines some of the challenges involved and potential solutions for integrating cMUT arrays with medical imagers. A review of some of the models from the literature is also given as a means to optimizing the cMUT design and impedance matching.
Keywords :
biomedical ultrasonics; capacitive sensors; impedance matching; integrated circuits; medical image processing; micromachining; microsensors; silicon compounds; ultrasonic transducer arrays; 10 MHz; 3 to 13 MHz; SiN; cMUT arrays; capacitive micromachined ultrasound transducer arrays; impedance matching; medical imaging; medical ultrasound; nonresonant devices; real time imaging; signal processing electronics; silicon nitride devices; wafer bonded probe; Array signal processing; Biomedical imaging; Biomedical transducers; Probes; Silicon; Testing; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; Wafer bonding;
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
Print_ISBN :
0-7803-8412-1
DOI :
10.1109/ULTSYM.2004.1417744