DocumentCode :
2968766
Title :
Demonstration of a novel 2.0 mm × 1.6 mm × 0.9 mm PCS Tx filter with steep pass band rolloffs and high rejection
Author :
Feld, David ; Bradley, Paul ; Yu, Bei ; Lee, Donald
Author_Institution :
Wireless Semicond. Div., Agilent Technol. Inc., San Jose, CA, USA
Volume :
1
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
420
Abstract :
Improved process control of a thin film bulk acoustic (FBAR) resonator process has enabled the development of a low cost, high performance transmit filter capable of replacing the existing dual-filter "split-band" solution used in many PCS communication systems today. This transmit filter, centered at 1880 MHz, meets seven stringent specification requirements over a temperature range from -30C to +85C: (1) insertion loss < 3.5 dB over a 60 MHz (3%) bandwidth; (2) above band rejection > 35 dB over the 60 MHz (3%) Rx band; (3) below band rejection > 25 dB over the 60 MHz (3%) image band; (4) low-frequency rolloff < 9.0 MHz (from 3.5 dB to 25 dB); (5) high-frequency rolloff < 8.0 MHz (from 3.5 dB to 35 dB); (6) Bluetooth rejection (at 2.5 GHz) > 30 dB and 2nd harmonic rejection (at 3.8 GHz) > 20 dB; and (7) an in-band return loss better than 10 dB. We present a novel filter design packaged in a 2.0 mm × 1.6 mm × 0.9 mm chip-on-board package, which meets these constraints. We discuss the process control requirements needed to produce this filter with high yields.
Keywords :
acoustic resonator filters; bulk acoustic wave devices; chip-on-board packaging; integrated circuit yield; personal communication networks; process control; thin film devices; -30 to 85 degC; 1880 MHz; 2.5 GHz; 3.8 GHz; 60 MHz; FBAR resonator; PCS Tx filter; chip-on-board package; high performance transmit filter; pass band rolloffs; process control; rejection; thin film bulk acoustic resonator; yields; Band pass filters; Costs; Film bulk acoustic resonators; Packaging; Personal communication networks; Process control; Propagation losses; Resonator filters; Temperature distribution; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1417752
Filename :
1417752
Link To Document :
بازگشت