DocumentCode
2968996
Title
Industry perspective on multi domain simulations and virtual prototyping
Author
Cottet, Didier
Author_Institution
Corp. Res., ABB Switzerland Ltd., Baden-Dattwil
fYear
2008
fDate
17-20 Aug. 2008
Firstpage
1
Lastpage
6
Abstract
In this paper, the application of multi-domain simulations and virtual prototyping is investigated in the context of industrial power electronic product development. A literature review provides the necessary comprehension and definition of the term virtual prototyping, best described by characteristic keywords such as communication, distributed collaboration, databases, process integration, or design culture. Concerning multi-domain simulation, a selection of examples is illustrating different variants, such as multi-solver, multi-physics, multi-disciplines and multi-dimension. Based on the above definitions, it is shown how the expectations and research needs in virtual prototyping and multi-domain simulations change with regard to new opportunities, benefits and enabling factors. In the last part of the paper, virtual prototyping and multi-domain simulations are brought into a typical power electronics product development context, addressing risks, challenges, requirements, and R&D implications. The conclusion drawn is the fact that multi domain simulation activities are currently growing at a rapid pace, thus reflecting the growing importance of packaging and hardware integration in power electronics. The challenges today are therefore to handle this growth with special regard to knowhow availability, tools availability and the ability to integrate multi-domain simulation and virtual prototyping into existing product development processes.
Keywords
electronic engineering computing; electronics packaging; power electronics; product development; virtual prototyping; hardware integration; industrial power electronic product development; multidomain simulations; packaging; virtual prototyping; Collaboration; Context modeling; Distributed databases; Electronics industry; Electronics packaging; Hardware; Power electronics; Process design; Product development; Virtual prototyping;
fLanguage
English
Publisher
ieee
Conference_Titel
Control and Modeling for Power Electronics, 2008. COMPEL 2008. 11th Workshop on
Conference_Location
Zurich
Print_ISBN
978-1-4244-2550-1
Electronic_ISBN
978-1-4244-2551-8
Type
conf
DOI
10.1109/COMPEL.2008.4634696
Filename
4634696
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