Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

Author

Young, Choong-Reol ; Jae-Nyun Yoo

Author_Institution

Electron. & Telecommun. Res. Inst., Taejon, South Korea

fYear

1997

fDate

13-15 Oct 1997

Firstpage

1

Lastpage

5

Abstract

In this paper, we summarize the work in the field of assessing the reliability of printed board assemblies of a switching system, applying the method of the high temperature accelerated life-test. A test for reliability assessment of printed board assemblies having many different kinds of components in a large variety of complexity is very important to classify the failures. We calculate the acceleration factor of taking into consideration of the complexity of a printed board assembly. An actual accelerated test with accelerated factors obtained by the Arrhenius are conducted with 30 samples during two months. Test result are analyzed applying the Weibull-log linear model. The analysis show that the design characteristics are adequate to satisfy the requirement of reliability

Keywords

circuit reliability; failure analysis; high-temperature effects; life testing; printed circuit testing; PCB assemblies; Weibull-log linear model; acceleration factor; failure rate; high temperature accelerated life test; printed board assemblies; reliability; switching system; Acceleration; Assembly systems; Electronic equipment testing; Integrated circuit reliability; Life estimation; Life testing; Switching systems; System testing; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626864

Filename

626864