DocumentCode :
2969177
Title :
Microfabricated ultrasonic transducers monolithically integrated with high voltage electronics
Author :
Daft, Chris ; Calmes, Sam ; Da Graca, Daniel ; Patel, Kirti ; Wagner, Paul ; Ladabaum, Igal
Author_Institution :
Sensant Corp., San Leandro, CA, USA
Volume :
1
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
493
Abstract :
Capacitive microfabricated ultrasonic transducers (cMUTs) recently produced clinical-quality images, and have the potential to enable true 3D ultrasound. Much has been written about the value of integrating cMUTs with electronics, and some early work has been published (Eccardt, P.-C. et al., 1996; Noble, R.A. et al., 2002). The paper describes monolithic integration of high-quality imaging cMUTs with analog switching electronics. The switching circuitry used has the same voltage limitations as commercial multiplexing chips (200 VPP). Water tank results demonstrate that cMUTs integrated with controlling switches are fully-functional when the capacitance and resistance of the switch are inserted into the cMUT model. The results further demonstrate no measurable effect of the switch on the radiation pattern of the acoustic elements. This verifies the viability of aperture control and channel multiplexing with monolithically integrated electronics. In the short term, such integration can allow for reconfigurable apertures, arrays with many elevation rows, and optimal preamplification. it also represents a step towards a practical 2D matrix transducer, due to the density of its integration and the freedom to optimize separately the cMUT and the integrated electronics.
Keywords :
CMOS analogue integrated circuits; analogue integrated circuits; biomedical ultrasonics; capacitive sensors; micromachining; microsensors; monolithic integrated circuits; switching circuits; ultrasonic transducer arrays; 200 V; 2D matrix transducer; 3D ultrasound; analog switching electronics; aperture control; capacitive microfabricated ultrasonic transducers; channel multiplexing; controlling switches; high voltage electronics; microfabrication; monolithic integrated electronics; preamplification; radiation pattern; reconfigurable apertures; switch capacitance; switch resistance; Acoustic measurements; Apertures; Capacitance; Electrical resistance measurement; Monolithic integrated circuits; Switches; Switching circuits; Ultrasonic imaging; Ultrasonic transducers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1417770
Filename :
1417770
Link To Document :
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