• DocumentCode
    2969673
  • Title

    3D integration infrastructure & market status

  • Author

    Zinck, Christophe

  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    34
  • Abstract
    A collection of slides for the author´s conference is presented. Topic discussed is about 3D integration infrastructure and its market status.
  • Keywords
    integrated circuit manufacture; packaging; semiconductor industry; 3D IC market; 3D integration infrastructure; packaging; CMOS image sensors; Driver circuits; Investments; Silicon; Three dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751425
  • Filename
    5751425
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2969673