DocumentCode
2969992
Title
2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515)
fYear
2000
fDate
23-26 Oct. 2000
Abstract
The following topics were dealt with: wafer-level reliability testing; dielectric reliability; gate oxide reliability; IC circuit fabrication; electromigration; burn-in testing; non-volatile memories; failure analysis; MEMS reliability; time-dependent dielectric breakdown
Keywords
reliability; IC circuit fabrication; MEMS reliability; burn-in testing; dielectric reliability; electromigration; failure analysis; gate oxide reliability; nonvolatile memories; reliability; time-dependent dielectric breakdown; wafer-level testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location
Lake Tahoe, CA, USA
Print_ISBN
0-7803-6392-2
Type
conf
DOI
10.1109/IRWS.2000.911889
Filename
911889
Link To Document