Title :
On the methodology of assessing hot-carrier reliability of analog circuits
Author :
Le, Huy ; Marcoux, Paul.J. ; Jiang, Wei ; Chung, Jason E.
Author_Institution :
Agilent Technol., Santa Clara, CA, USA
Abstract :
An integrated methodology for assessing analog hot-carrier reliability is proposed. Taking advantage of the unique requirements of analog circuits as well as the well-developed circuit analysis techniques, the methodology focuses on the characterization and modeling of ΔVT and Δμ (as a function of hot-carrier degradation) at the device level and seeks to model circuit-level DC performance parameters degradation through analytical expressions derived from SPICE Model 1
Keywords :
SPICE; analogue integrated circuits; hot carriers; integrated circuit reliability; SPICE model; analog integrated circuit; hot carrier reliability; Analog circuits; Circuit analysis; Circuit simulation; Degradation; Equations; Hot carriers; Integrated circuit reliability; Integrated circuit technology; Ring oscillators; SPICE;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-6392-2
DOI :
10.1109/IRWS.2000.911893
