• DocumentCode
    2970170
  • Title

    Soft breakdown model of 20 Å gate oxide

  • Author

    Ko, Chin-Yuan ; Shiue, R.Y. ; Yue, J.

  • Author_Institution
    Dept. of Reliability Assurance, Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    51
  • Lastpage
    53
  • Abstract
    In this work, we apply percolation concepts and point contact concept to explain almost all the soft breakdown (SB) phenomenon of 20 Å gate oxide, and this is the first time to combine theses two theory to model the ultra-thin oxide soft breakdown mechanism. Percolation model is a approach based on statistics; whereas, point contact interpret SB phenomena in view of physics. Statistical approach can explain statistical properties, and physical approach can explain physical features. By proving the conduction after SB is dominated by ballistic transport, we can explain two-level fluctuation by means of point contact
  • Keywords
    MOS capacitors; percolation; point contacts; semiconductor device breakdown; 20 angstrom; MOS capacitor; SiO2; ballistic transport; electrical conduction; percolation model; point contact; soft breakdown; statistical properties; two-level fluctuation; ultrathin gate oxide; Charge measurement; Conductors; Current measurement; Dielectric breakdown; Electric breakdown; Electrons; Semiconductor device breakdown; Stress measurement; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2000 IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-6392-2
  • Type

    conf

  • DOI
    10.1109/IRWS.2000.911899
  • Filename
    911899