DocumentCode :
2970259
Title :
Ultrasonic imaging of fingerprints using acoustical impediography
Author :
Schmitt, R.M. ; Scott, W.G. ; Irving, R.D. ; Arnold, J. ; Bardons, C. ; Halpert, D. ; Parker, L.
Author_Institution :
CrossMatch Technol., FL, USA
Volume :
1
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
680
Abstract :
A new type of fingerprint sensor is presented. The sensor maps the acoustic impedance of the fingerprint pattern by estimating the electrical impedance of its sensor elements. The sensor substrate, made of 1-3 piezo-ceramic, which is fabricated inexpensively at large scales, can provide a resolution up to 50 μm over an area of 25×25 mm2. Using FE modeling, this paper presents the numerical validation of the basic principle. It evaluates an optimized pillar aspect ratio, models spatial resolution and the point spread function for a 100 μm and 50 μm pitch model. The sensor manufacturing process is briefly addressed and the first fingerprints obtained with the prototype sensor are presented. Finally an outlook is given for deploying the sensor to obtain additional life information by using it as a pulse echo system.
Keywords :
acoustic impedance; fingerprint identification; finite element analysis; piezoceramics; piezoelectric transducers; ultrasonic imaging; ultrasonic transducer arrays; 100 micron; 25 mm; 50 micron; FEM; acoustical impediography; fingerprint pattern acoustic impedance mapping; fingerprint sensor; fingerprint ultrasonic imaging; optimized pillar aspect ratio; piezo-ceramic sensor; point spread function; pulse echo system; sensor elements electrical impedance; spatial resolution; Acoustic sensors; Fingerprint recognition; Impedance; Iron; Large-scale systems; Manufacturing processes; Prototypes; Sensor systems; Spatial resolution; Ultrasonic imaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1417814
Filename :
1417814
Link To Document :
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