DocumentCode
2970312
Title
Kinetic model of heating of metal microdroplet by surrounding plasma
Author
Shmelev, D.L. ; Uimanov, I.V.
Author_Institution
Inst. of Electrophys., Ekaterinburg, Russia
fYear
2012
fDate
2-7 Sept. 2012
Firstpage
357
Lastpage
360
Abstract
A kinetic one-dimensional spherically symmetric model of heating of metal microdroplet (with radius 1-2 micrometers) by surrounding plasma was developed. The kinetic model is a model of 1D3V PIC/DSMC type. The model describes the thermo-field electron emission and evaporation from the droplet surface as well as correspondent plasma creation. Thus the droplet heating is modeled selfconsistently, taking into account the influence of the plasma generated during the process. The calculations have shown, that beginning from the certain surface temperature the droplet heated mostly by electron flux from the plasma. A certain kind of thermal instability takes place in the developed model. Beginning from the certain value, the droplet surface temperature grows exponentially and reaches the critical temperature, after that the calculation is stopped because of model restrictions.
Keywords
copper; drops; evaporation; plasma heating; plasma instability; plasma production; plasma simulation; plasma temperature; thermionic electron emission; 1D3V PIC-DSMC type; Cu; copper droplet; critical temperature; droplet surface; electron flux; evaporation; kinetic one-dimensional spherically symmetric heating model; metal microdroplet; plasma creation; plasma generation; radius 1 mm to 2 mm; surface temperature; surrounding plasma; thermal instability; thermofield electron emission; Cathodes; Electric potential; Heating; Metals; Plasma temperature; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
Conference_Location
Tomsk
ISSN
1093-2941
Print_ISBN
978-1-4673-1263-9
Electronic_ISBN
1093-2941
Type
conf
DOI
10.1109/DEIV.2012.6412527
Filename
6412527
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