• DocumentCode
    2970312
  • Title

    Kinetic model of heating of metal microdroplet by surrounding plasma

  • Author

    Shmelev, D.L. ; Uimanov, I.V.

  • Author_Institution
    Inst. of Electrophys., Ekaterinburg, Russia
  • fYear
    2012
  • fDate
    2-7 Sept. 2012
  • Firstpage
    357
  • Lastpage
    360
  • Abstract
    A kinetic one-dimensional spherically symmetric model of heating of metal microdroplet (with radius 1-2 micrometers) by surrounding plasma was developed. The kinetic model is a model of 1D3V PIC/DSMC type. The model describes the thermo-field electron emission and evaporation from the droplet surface as well as correspondent plasma creation. Thus the droplet heating is modeled selfconsistently, taking into account the influence of the plasma generated during the process. The calculations have shown, that beginning from the certain surface temperature the droplet heated mostly by electron flux from the plasma. A certain kind of thermal instability takes place in the developed model. Beginning from the certain value, the droplet surface temperature grows exponentially and reaches the critical temperature, after that the calculation is stopped because of model restrictions.
  • Keywords
    copper; drops; evaporation; plasma heating; plasma instability; plasma production; plasma simulation; plasma temperature; thermionic electron emission; 1D3V PIC-DSMC type; Cu; copper droplet; critical temperature; droplet surface; electron flux; evaporation; kinetic one-dimensional spherically symmetric heating model; metal microdroplet; plasma creation; plasma generation; radius 1 mm to 2 mm; surface temperature; surrounding plasma; thermal instability; thermofield electron emission; Cathodes; Electric potential; Heating; Metals; Plasma temperature; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
  • Conference_Location
    Tomsk
  • ISSN
    1093-2941
  • Print_ISBN
    978-1-4673-1263-9
  • Electronic_ISBN
    1093-2941
  • Type

    conf

  • DOI
    10.1109/DEIV.2012.6412527
  • Filename
    6412527