Title :
Reliability of via and its diagnosis by e-beam probing
Author :
Xia, William ; Villafana, Martin ; Tappan, Jonathan ; Watson, Tim ; Campbell, Michael
Author_Institution :
Qualcomm Inc., San Diego, CA, USA
Abstract :
A stress-related intermittent via failure was investigated in an unstable digital circuit of a mixed signal device by novel use of an e-beam probing technique. The failed via structure was traced and identified by an e-beam prober connected to an ATE tester. FIB, SEM, and TEM analysis of the failed via structure showed voids and an anomalous thin layer under the Ti/TiN adhesion layer at the interface of tungsten plug and AlCu alloy
Keywords :
electron beam testing; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; mixed analogue-digital integrated circuits; voids (solid); ATE tester; FIB analysis; SEM; TEM; Ti-TiN; Ti/TiN adhesion layer; W-AlCu; digital circuit; electron beam probing; failure diagnosis; mixed signal device; reliability; tungsten plug/AlCu alloy interface; via interconnect; void; Adhesives; Circuit testing; Digital circuits; Failure analysis; Integrated circuit interconnections; Plugs; System testing; Tin; Tungsten; Voltage;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-6392-2
DOI :
10.1109/IRWS.2000.911911
