A versatile pick and place tool for ultraprecise placement-demonstrated by the application in an advanced MCM-D technology

Author

Guide, P. ; Bornholdt, O. ; Neumann, Gerold

Author_Institution

Fraunhofer-Inst. fur Siliziumtechnol. ISIT, Itzehoe, Germany

fYear

1997

fDate

13-15 Oct 1997

Firstpage

44

Lastpage

47

Abstract

Multichip modules for high performance applications are mostly realized in the MCM-D technology and have to satisfy a number of different requirements. Therefore new MCM-D techniques are still under development. A newly developed MCM-D approach based on chip-first technology is presented that is addressed to high-frequency systems as well as to highest interconnect densities. This development includes the set-up of a high precision pick and place tool, that allows the placing of chips with an accuracy of better than 5 μm. The set-up and the operation of this tool are described in detail

Keywords

integrated circuit manufacture; microassembling; multichip modules; advanced MCM-D technology; chip placement; chip-first technology; high interconnect densities; high-frequency systems; multichip modules; pick and place tool; ultraprecise placement; Contacts; Dielectric substrates; Dielectric thin films; Electronic components; Frequency; Manufacturing; Metallization; Nonhomogeneous media; Silicon; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626874

Filename

626874