DocumentCode :
2970463
Title :
Identification of atomic scale defects involved in oxide leakage currents
Author :
Lenahan, P.M. ; Mele, J.J. ; Campbell, J. ; Kang, A. ; Lowry, R.K. ; Woodbury, D. ; Liu, S.T.
Author_Institution :
Pennsylvania State Univ., University Park, PA, USA
fYear :
2000
fDate :
2000
Firstpage :
112
Lastpage :
115
Abstract :
We present evidence linking specific atomic scale defects to leakage currents in thermally grown silicon dioxide thin films on silicon. The defects identified are oxygen deficient silicon “dangling bond” centers. These centers have been identified through electron spin resonance measurements. We find a strong correspondence between the generation of an oxygen deficient silicon dangling bond defect in the oxide and the appearance of oxide leakage currents. We observe a strong correlation between the disappearance of these centers and the disappearance of leakage currents in relatively low temperature anneals (200°C) in air
Keywords :
annealing; dangling bonds; insulating thin films; leakage currents; paramagnetic resonance; silicon compounds; 200 C; Si; SiO2; annealing; atomic scale defect; dangling bond; electron spin resonance; leakage current; silicon dioxide thin film; silicon substrate; thermal oxide; Atomic measurements; Bonding; Extraterrestrial measurements; Joining processes; Leakage current; Lighting; Paramagnetic resonance; Semiconductor thin films; Silicon compounds; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-6392-2
Type :
conf
DOI :
10.1109/IRWS.2000.911913
Filename :
911913
Link To Document :
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