Title :
Electromigration discussion group summary moderators
Author :
Schafft, Harry A. ; Sullivan, Timothy D.
Author_Institution :
IBM Microelectronics
Keywords :
Electromigration; Life estimation; Metallization; Microelectronics; NIST; Stress; Temperature; Testing; Thermal conductivity; Thermal resistance;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2000 IEEE International
Print_ISBN :
0-7803-6392-2
DOI :
10.1109/IRWS.2000.911916
