Title :
An advanced step for the conventional CMOS ASIC package
Author :
Otsuka, Kanji ; Shirai, Yuji ; Okinaga, Takayuki ; Utsumi, Yasuyuki ; Koide, Kazuo
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Abstract :
A ceramic pin grid array (PGA) with improved 40-μm-line thin-film aluminum metallization is described. Fine pitch bonding on 120-μm centers has been successfully implemented. The 400-pin array package is no larger than the previous 240-pin packages. Worst-case capacitances of 1.94 pF, and inductances of 8.5 nH, have been achieved with further reductions possible. The thermal resistance of the package is 6.5°C/W using an aluminum cap with aluminum fins and solder glass sealing
Keywords :
CMOS integrated circuits; aluminium; application specific integrated circuits; integrated circuit technology; metallisation; packaging; 1.94 pF; 40 micron; 400-pin array package; Al cap; Al fins; CMOS ASIC package; ceramic PGA; fine pitch bonding; monolithic IC; pin grid array; solder glass sealing; thermal resistance; thin film Al metallisation; Aluminum; Application specific integrated circuits; Bonding; Capacitance; Ceramics; Electronics packaging; Glass; Metallization; Thermal resistance; Transistors;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77848
