Title :
Advanced solder bumping technology through super solder
Author :
Hikasa, Kazuhito ; Irie, Hisao
Author_Institution :
Furukawa Electr. Co. Ltd., Yokohama, Japan
Abstract :
Furukawa Electric has developed method of eluding high-purity solder directly onto fine-pitch contacts through lattice substitution, called Super Solder (SS). The technology has already been adopted in precoating for boards mounting Pentium chips. SS supplies solder to fine-pitch electrode pads through a very simple process consisting of paste coat and heating, and is well suited to the needs of bump formation, especially on boards. This paper covers the configuration and characteristics of a production line providing fully-automatic bump formation with high yield, low labor requirements, and at a low capital investment
Keywords :
fine-pitch technology; flip-chip devices; multichip modules; printed circuit manufacture; soldering; Furukawa Electric; fine-pitch contacts; flip-chip mounting; fully-automatic bump formation; high-purity solder; lattice substitution; paste coating; paste heating; production line; solder bumping technology; super solder technology; Character generation; Composite materials; Electrodes; Extraterrestrial measurements; Manufacturing; Powders; Printing; Volume measurement;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626875
