Title :
Developing aged SPICE model for hot carrier reliability simulation
Author :
Ye, Qiuyi ; Terletzki, H. ; Tonti, W.
Author_Institution :
Infineon Technol., Hopewell Junction, NY, USA
Abstract :
A systematic method to develop aged SPICE model for hot carrier reliability simulation is proposed in this paper. This method not only simplifies the aged model develop procedure, but also solves the problem of modeling reverse stress mode and have good model scalability
Keywords :
SPICE; ageing; hot carriers; integrated circuit modelling; integrated circuit reliability; aged SPICE model; hot carrier reliability simulation; reverse stress mode; scalability; Aging; Curve fitting; Data mining; Degradation; Differential equations; Hot carriers; Microelectronics; SPICE; Scalability; Stress;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-6392-2
DOI :
10.1109/IRWS.2000.911926
