Title :
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment
Author :
Gaudin, Gweltaz ; Riou, Gregory ; Landru, Didier ; Tempesta, Catherine ; Radu, Ionut ; Sadaka, Mariam ; Winstel, Kevin ; Kinser, Emily ; Hannon, Robert
Author_Institution :
SOITEC, Grenoble, France
Abstract :
In this paper the integration challenges related to oxide-oxide bonding for wafer-to-wafer stacking technology are discussed. Furthermore, interface defectivity, wafer-to-wafer alignment and bond strength data are presented.
Keywords :
three-dimensional integrated circuits; wafer bonding; 3D integration; bond strength; direct wafer-wafer bonding; low-temperature bonding; oxide-oxide bonding; surface preparation; wafer-to-wafer alignment; Bonding; Planarization; Plasma temperature; Surface topography; Three dimensional displays; Wafer bonding; 3D stacking; alignment; low temperature direct bonding; wafer to wafer;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751472
